What are you going to learn?
- Techniques for failure verification.
- Advanced methods in device preparation.
- Technical procedures for package inspection.
- Methods for cross section analysis.
- Procedures for chip exposure.
- Step-by-step delayering of chips: mechanical, wet chemical and modern plasma dry etching techniques.
- Techniques for failure isolation.
- Advance techniques for fault isolation: FIB microsurgery, AFM nanoprobing.
- Material analysis techniques.
Content
Chapter 1. Data Collection
- Data Sheets
- Design Review Data
- Reliability Data
- Test Specifications
Chapter 2. Failure Verification
- Electrical Test on the Automatic Test Equipment (ATE)
- Electrical Verification on the Bench
Chapter 3. External Visual Examination
- Inspection with Naked Eye
- Inspection Using High Magnification Microscopes
Chapter 4. Device Assembly Inspection
- Radiographic Examination (X-rays)
- Scanning Acoustic Microscopy
- Time Domain Reflectometry (TDR)
- Cross Section Analysis
Chapter 5. Preliminary Report
- Summary
- Introduction
- Background Information
- Failure Mode Verification
Chapter 6. Decapsulation
- Analysis of Device Package
- Automatic Decapsulation: Acids, Lasers, Milling
- Manual Decapsulation
Chapter 7. Fault Isolation
- Internal Visual Examination
- Microprobing
- Ion Beam Testing
- Photoemission Analysis
- IR-OBIRCH Analysis
- Dynamic Laser Stimulation Analysis (DLS)
- Thermal Emission Analysis
Chapter 8. Interim Report
- Summary
- Introduction
- Background Information
- Methodology
- Observations and Findings
- Analysis
Chapter 9. Delayering
- Manual Surface Polishing
- Wet Etch
- Automated Surface Polishing
- Dry Etch, Reactive Ion Etching (RIE)
Chapter 10. Optical / SEM Inspection
- Optical Inspection
- Inspection with a Scanning Electron Microscope (SEM)
- Inspection with a Transmission Electron Microscope (TEM)
Chapter 11. Material Analysis
- Energy Dispersive Spectroscopy (EDS)
Chapter 12. Final Report
- Data Sheets
- Design Review Data
- Reliability Data
- Test Specifications
Bibliography
- Wagner, L., Failure Analysis of Integrated Circuits: Tools and Techniques. Kluwer Academic Publishers, Boston, MA, 1999.