What are you going to learn?
Content
Techniques for failure verification.
Advanced methods in device preparation.
Technical procedures for package inspection.
Methods for cross section analysis.
Procedures for chip exposure.
Step-by-step delayering of chips: mechanical, wet chemical and modern plasma dry etching techniques.
Techniques for failure isolation.
Advance techniques for fault isolation: FIB microsurgery, AFM nanoprobing.
Material analysis techniques.
Chapter 1. Data Collection
Data Sheets
Design Review Data
Reliability Data
Test Specifications
Chapter 2. Failure Verification
Electrical Test on the Automatic Test Equipment (ATE)
Electrical Verification on the Bench
Chapter 3. External Visual Examination
Inspection with Naked Eye
Inspection Using High Magnification Microscopes
Chapter 4. Device Assembly Inspection
Radiographic Examination (X-rays)
Scanning Acoustic Microscopy
Time Domain Reflectometry (TDR)
Cross Section Analysis
Chapter 5. Preliminary Report
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Chapter 6. Decapsulation
Analysis of Device Package
Automatic Decapsulation: Acids, Lasers, Milling
Manual Decapsulation
Chapter 8. Fault Isolation
Internal Visual Examination
Microprobing
Ion Beam Testing
Photoemission Analysis
IR-OBIRCH Analysis
Dynamic Laser Stimulation Analysis (DLS)
Thermal Emission Analysis
Chapter 10. Interim Report
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Chapter 11. Delayering
Manual Surface Polishing
Wet Etch
Automated Surface Polishing
Dry Etch, Reactive Ion Etching (RIE)
Chapter 12. Optical SEM Inspection
Optical Inspection
Inspection with a Scanning Electron Microscope (SEM)
Inspection with a Transmission Electron Microscope (TEM)
Chapter 13. Material Analysis
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Chapter 14. Final Report
Summary
Introduction
Background Information
Methodology
Observations and Findings
Analysis
Root Cause Analysis
Recommendations
Appendices
Bibliography
Wagner, L., Failure Analysis of Integrated Circuits: Tools and Techniques. Kluwer Academic Publishers, Boston, MA, 1999.
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